JPH0739231Y2 - 超高速プローブ基板 - Google Patents

超高速プローブ基板

Info

Publication number
JPH0739231Y2
JPH0739231Y2 JP1987156262U JP15626287U JPH0739231Y2 JP H0739231 Y2 JPH0739231 Y2 JP H0739231Y2 JP 1987156262 U JP1987156262 U JP 1987156262U JP 15626287 U JP15626287 U JP 15626287U JP H0739231 Y2 JPH0739231 Y2 JP H0739231Y2
Authority
JP
Japan
Prior art keywords
substrate
coaxial cable
metal
coated
flexible coaxial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987156262U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363932U (en]
Inventor
透 高田
Original Assignee
エヌティティエレクトロニクステクノロジー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エヌティティエレクトロニクステクノロジー株式会社 filed Critical エヌティティエレクトロニクステクノロジー株式会社
Priority to JP1987156262U priority Critical patent/JPH0739231Y2/ja
Publication of JPH0363932U publication Critical patent/JPH0363932U/ja
Application granted granted Critical
Publication of JPH0739231Y2 publication Critical patent/JPH0739231Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1987156262U 1987-10-13 1987-10-13 超高速プローブ基板 Expired - Lifetime JPH0739231Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987156262U JPH0739231Y2 (ja) 1987-10-13 1987-10-13 超高速プローブ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987156262U JPH0739231Y2 (ja) 1987-10-13 1987-10-13 超高速プローブ基板

Publications (2)

Publication Number Publication Date
JPH0363932U JPH0363932U (en]) 1991-06-21
JPH0739231Y2 true JPH0739231Y2 (ja) 1995-09-06

Family

ID=31699504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987156262U Expired - Lifetime JPH0739231Y2 (ja) 1987-10-13 1987-10-13 超高速プローブ基板

Country Status (1)

Country Link
JP (1) JPH0739231Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045950A (ja) * 2006-08-11 2008-02-28 Japan Electronic Materials Corp プローブカード

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004309257A (ja) * 2003-04-04 2004-11-04 Micronics Japan Co Ltd プローブカード
JP2007222229A (ja) * 2006-02-21 2007-09-06 Kazuo Kajiwara マッサージ器
JP6118710B2 (ja) * 2013-10-30 2017-04-19 日本電子材料株式会社 プローブカード

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60139276U (ja) * 1984-02-24 1985-09-14 日本電子材料株式会社 プロ−ブカ−ド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045950A (ja) * 2006-08-11 2008-02-28 Japan Electronic Materials Corp プローブカード

Also Published As

Publication number Publication date
JPH0363932U (en]) 1991-06-21

Similar Documents

Publication Publication Date Title
US6400168B2 (en) Method for fabricating probe tip portion composed by coaxial cable
US4749942A (en) Wafer probe head
JP3502874B2 (ja) 接続装置およびその製造方法
US6420884B1 (en) Contact structure formed by photolithography process
KR100733945B1 (ko) 실리콘 핑거 접촉기를 갖는 접촉 구조체 및 그 제조 방법
JP2001506752A (ja) 高速テスト用プローブカード
JP2003207523A (ja) コンタクタ及びその製造方法並びにコンタクト方法
CN108735678B (zh) 一种量子裸芯片立体封装结构及其封装方法
KR20000064001A (ko) 프로브 및 프로브 카드
JPH0739231Y2 (ja) 超高速プローブ基板
US5563522A (en) Microwave band probing apparatus
TW202309540A (zh) 用於探測待測裝置的設備及方法
JP4427645B2 (ja) コンタクトプローブ、そのコンタクトプローブに用いる測定用パッド、及びそのコンタクトプローブの作製方法
JPH10132855A (ja) Ic検査用プローブカード
JPH07335701A (ja) プロービング装置
EP0220830A2 (en) Wafer probe head, and method of assembling a wafer probe head
JP3502875B2 (ja) 接続装置およびその製造方法
JPH0580124A (ja) 半導体素子検査装置
JP3249865B2 (ja) 半導体集積回路装置の製造方法
JP3204146B2 (ja) コンタクトプローブおよびその製造方法、並びにコンタクトプローブを備えたプローブ装置
JP2001242195A (ja) コンタクトストラクチャ
JP2568495B2 (ja) 半導体装置
JP3346279B2 (ja) コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2001330628A (ja) 半導体装置の製造方法
JP3446636B2 (ja) コンタクトプローブ及びプローブ装置